While small batches (e.g., 10 units) are useful for testing, increasing to a slightly higher number (e.g., 30) often offers a better economy of scale.

Technicians use magnification tools to inspect solder joints for quality.

High-resolution cameras check components for correct placement, polarity, and soldering defects.

(e.g., debugging a prototype, verifying a production run, or identifying a specific failure)

To provide a more detailed write-up, additional information would be helpful:

Essential for detecting hidden defects under components like BGA (Ball Grid Array), checking for voids and solder bridges.